Introduction
- Optimized for virtualization, performance and highly scalable networking
- Embedded Virtual Fabric allows breakthrough I/O flexibility
- Designed for simplified deployment and management
Get the most
The LenovoŽ Flex SystemT x240 Compute Node delivers powerful performance with IntelŽ XeonŽ processors-up to a 50 percent performance boost over previous generation servers.1 This enables businesses to get more out of their compute environment. Features such as automated power management with onboard sensors give you more control over power and thermal levels across the system. These capabilities, combined with memory capacity up to 768 GB, help you get the most out of your compute environment.
Product features
- Optimized for virtualization, performance and highly scalable I/O
- Designed for simplified deployment and management
- LenovoŽ XClarityT delivers a centralized systems management solution that helps administrators deliver infrastructure faster and with less effort
- Virtual networking with integrated virtual fabric and up to 32 virtual networking ports
Processor
Processor manufacturer
Intel
Processor model
E5-2670V2
Processor frequency
2.5 GHz
Processor boost frequency
3.3 GHz
Processor family
IntelŽ XeonŽ E5 V2 Family
Processor cores
10
Processor cache
25 MB
Motherboard chipset
Intel C600
Memory channels supported by processor
Quad
Number of processors installed
1
Thermal Design Power (TDP)
115 W
Processor cache type
Smart Cache
System bus rate
8 GT/s
Maximum number of SMP processors
2
Processor socket
LGA 2011 (Socket R)
Processor lithography
22 nm
Processor threads
20
Processor operating modes
64-bit
FSB Parity
N
Bus type
QPI
Number of QPI links
2
Processor codename
Ivy Bridge EP
Tcase
82 °C
Maximum internal memory supported by processor
768 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333,1600,1866 MHz
Memory bandwidth supported by processor (max)
59.7 GB/s
ECC supported by processor
Y
Execute Disable Bit
Y
Idle States
Y
Thermal Monitoring Technologies
Y
Maximum number of PCI Express lanes
40
PCI Express configurations
x4, x8, x16
Processor package size
52.5 x 45 mm
Supported instruction sets
AVX
Scalability
2S
Physical Address Extension (PAE)
46 bit
Embedded options available
N
Processor series
Intel Xeon E5-2600 v2
Conflict-Free processor
N
Memory
Internal memory
8 GB
Memory slots
24x DIMM
Memory clock speed
1866 MHz
Maximum internal memory
768 GB
Storage
Maximum storage capacity
6.4 TB
HDD interface
Serial ATA, Serial Attached SCSI (SAS)
HDD size
2.5"
RAID support
Y
RAID levels
0,1
Hot-swap
Y
Graphics
Maximum graphics card memory
16 MB
Network
Ethernet LAN
N
Ports & interfaces
USB 2.0 ports quantity
1
Expansion slots
PCI Express x16 (Gen 3.x) slots
1
PCI Express slots version
3.0
Software
Operating system installed
N
Compatible operating systems
Microsoft Windows Server 2008 R2, Red Hat Enterprise Linux 5 and 6, SUSE Linux Enterprise Server 10 and 11, VMware ESX 4
Processor special features
CPU configuration (max)
2
Intel Rapid Storage Technology
N
Enhanced Intel SpeedStep Technology
Y
IntelŽ Identity Protection Technology (IntelŽ IPT)
N
IntelŽ Wireless Display (IntelŽ WiDi)
N
Intel Virtualization Technology for Directed I/O (VT-d)
Y
IntelŽ Anti-Theft Technology (IntelŽ AT)
N
IntelŽ Hyper Threading Technology (IntelŽ HT Technology)
Y
IntelŽ My WiFi Technology (IntelŽ MWT)
N
IntelŽ Turbo Boost Technology
2.0
IntelŽ Quick Sync Video Technology
N
IntelŽ InTru 3D Technology
N
IntelŽ Clear Video HD Technology (IntelŽ CVT HD)
N
IntelŽ Insider
N
Intel Flex Memory Access
N
IntelŽ AES New Instructions (IntelŽ AES-NI)
Y
Intel Trusted Execution Technology
Y
Intel Enhanced Halt State
Y
Intel VT-x with Extended Page Tables (EPT)
Y
Intel Demand Based Switching
Y
IntelŽ Secure Key
Y
Intel TSX-NI
N
IntelŽ OS Guard
Y
Intel Clear Video Technology
N
IntelŽ Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
N
Intel 64
Y
Intel Identity Protection Technology version
0.00
Intel Secure Key Technology version
1.00
Intel Virtualization Technology (VT-x)
Y
Intel TSX-NI version
0.00
Intel Dual Display Capable Technology
N
Intel FDI Technology
N
Intel Fast Memory Access
N
Processor ARK ID
75275
Operational conditions
Operating temperature (T-T)
5 - 40 °C
Storage temperature (T-T)
1 - 60 °C
Operating relative humidity (H-H)
8 - 85%
Storage relative humidity (H-H)
5 - 80%
Operating altitude
0 - 3048 m
Non-operating altitude
0 - 10700 m
Weight & dimensions
Width
217 mm
Depth
492 mm
Height
56 mm
Package width
430 mm
Package depth
603 mm
Package height
197 mm
Package weight
8 kg
Other features
Graphics card
G200eR2
Graphics card family
Matrox
